Semiconductor Layer Stack Diagram - Integrated Circuit Packaging Design #2264575 (License: Personal Use)

This technical line drawing depicts a multi-layer integrated circuit packaging structure, where component 10 represents the base substrate, 12 indicates conductive traces or redistribution layers, and 16 denotes vertical interconnects such as through-silicon vias or bonding pads. The layered configuration enables high-density interconnection in advanced IC packages like fan-out wafer-level packaging (FOWLP) or 2.5D/3D integration.

Used in patent filings, technical whitepapers, semiconductor design guides, and educational content about IC packaging; targets engineers, researchers, and IP professionals seeking structural clarity on chip stacking and interconnect methodologies.